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  1998 microchip technology inc. ds11109j-page 1 features fast read access time?50 ns cmos technology for low power dissipation - 30 ma active - 100 m a standby fast byte write time?00 m s or 1 ms data retention >200 years high endurance - minimum 100,000 erase/write cycles automatic write operation - internal control timer - auto-clear before write operation - on-chip address and data latches data polling ready/busy chip clear operation enhanced data protection -v cc detector - pulse filter - write inhibit electronic signature for device identi?ation 5-volt-only operation organized 8kx8 jedec standard pinout - 28-pin dual-in-line package - 32-pin plcc package - 28-pin soic package available for extended temperature ranges: - commercial: 0?c to +70?c - industrial: -40? to +85? description the microchip technology inc. 28c64a is a cmos 64k non- volatile electrically erasable prom. the 28c64a is accessed like a static ram for the read or write cycles without the need of external components. during a ?yte write? the address and data are latched internally, freeing the micropro- cessor address and data bus for other operations. following the initiation of write cycle, the device will go to a busy state and automatically clear and write the latched data using an internal control timer. to determine when the write cycle is complete, the user has a choice of monitoring the ready/ busy output or using data polling. the ready/busy pin is an open drain output, which allows easy con?uration in wired- or systems. alternatively, data polling allows the user to read the location last written to when the write operation is com- plete. cmos design and processing enables this part to be used in systems where reduced power consumption and reli- ability are required. a complete family of packages is offered to provide the utmost ?xibility in applications. package types block diagram ?pin 1 indicator on plcc on top of package ?1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 rdy/bsy a12 a7 a6 a5 a4 a3 a2 a1 a0 i/o0 i/o1 i/o2 v vcc we nc a8 a9 a11 oe a10 ce i/o7 i/o6 i/o5 i/o4 i/o3 ss a6 a5 a4 a3 a2 a1 a0 nc i/o0 a8 a9 a11 nc oe a10 ce i/o7 i/o6 a7 a12 rdy/bsy nu vcc we nc i/o1 i/o2 vss nu i/o3 i/o4 i/o5 14 15 16 17 18 19 20 4 3 2 1 32 31 30 29 28 27 26 25 24 23 22 21 5 6 7 8 9 10 11 12 13 dip/soic plcc i/o0 i/o7 input/output buffers chip enable/ output enable control logic ce oe data protection circuitry a12 y gating 16k bit cell matrix x decoder y decoder a0 data poll auto erase/write timing v cc v ss we l a t c h e s program voltage generation rdy/ busy 28c64a 64k (8k x 8) cmos eeprom
28c64a ds11109j-page 2 1998 microchip technology inc. 1.0 elect rical char a cteristics 1.1 maximum ra tings* v cc and input v oltages w . r .t . v ss ...... . -0.6v to + 6.25v v oltage on oe w . r .t . v ss ..................... . -0.6v to +13.5v v oltage on a9 w . r .t . v ss ...................... . -0.6v to +13.5v output v oltag e w . r .t . v ss ................. . -0.6v t o v cc +0.6v storage temperatur e ......................... . -65?c to +125?c ambient tem p . with p o wer applie d ....... . -50?c to +95?c *notice: stresses ab o v e those listed unde r ?axi m um ratings m a y cause pe r manent damage to the d e vic e . this is a stress r at- ing only and functional ope r ation of the d e vice at those or a n y other conditions ab o v e those indicated in the ope r ation listings of this speci?ation is not implied . exposure to maxi m um r ating con- ditions f or e xtended pe r iods m a y af f ect d e vice reliabilit y . t able 1-1: pin functio n t a ble name function a0 - a12 address inputs ce chip ena b le oe output ena b le we w r ite ena b le i/o0 - i/o7 data inputs/outputs r d y/busy ready/busy v cc +5v p o wer supply v ss ground nc no connect ; no inte r nal connection nu not used ; no exte r nal connection is all o wed t able 1-2: read/write operation dc characteristic v cc = +5v 10% commercial (c) : t amb = 0?c to +70?c indust r ial (i) : t amb = -40?c to +85?c p arameter status symbol min max units conditions input v oltages logic ? logic ? v ih v il 2.0 -0.1 vcc+1 0.8 v v input leakage i li -10 10 m av in = -0.1v t o vcc +1 input capacitance c in 1 0 p f v in = 0 v ; t amb = 25?c; f = 1 mhz (note 2) output v oltages logic ? logic ? v oh v ol 2.4 0.45 v v i oh = -400 m a i ol = 2.1 ma output leakage i lo -10 10 m av out = -0.1v t o vcc +0.1v output capacitance c out 1 2 p f v in = 0 v ; t amb = 25?c; f = 1 mhz (note 2) p o wer supply current, acti v e ttl input i cc 3 0 m a f = 5 mhz (note 1) v cc = 5.5v p o wer supply current, stand b y ttl input ttl input cmos input i cc ( s ) ttl i cc ( s ) ttl i cc ( s ) cmos ? 3 100 ma ma m a ce = v ih (0?c to +70?c) ce = v ih (-40?c to +85?c) ce = v cc -0.3 t o vcc +1 oe = we = vcc all other inputs equa l v cc or v ss note 1 : a c p o wer supply current ab o v e 5mhz : 2ma/mhz. 2 : not 100% tested.
1998 microchip technology inc. ds11109j-page 3 28c64a table 1-3: read operation ac characteristics figure 1-1: read waveforms ac testing waveform: v ih = 2.4v; v il = 0.45v; v oh = 2.0v; v ol = 0.8v output load: 1 ttl load + 100 pf input rise and fall times: 20 ns ambient temperature: commercial (c): tamb = 0?c to +70?c industrial (i): tamb = -40?c to +85?c parameter symbol 28c64a -15 28c64a -20 28c64a -25 units conditions min max min max min max address to output delay t acc 150 200 250 ns oe = ce = v il ce to output delay t ce 150 200 250 ns oe = v il oe to output delay t oe ?0?0100nsce = v il ce or oe high to output float t off 0 50 0 55 0 70 ns (note 1) output hold from address, ce or oe , whichever occurs ?st. t oh 0??ns (note 1) endurance 1m 1m 1m cycles 25?, vcc = 5.0v, block mode (note 2) note 1: not 100% tested. 2: this parameter is not tested but guaranteed by characterization. for endurance estimates in a speci? appli- cation, please consult the total endurance model which can be obtained on our bbs or website. address ce v ih v il v ih v il v ih v il oe data we v oh v ol v ih v il address valid high z valid output t acc (1) t off is specified for oe or ce, whichever occurs first (2) oe may be delayed up to t ce - t oe after the falling edge of ce without impact on t ce (3) this parameter is sampled and is not 100% tested high z t oh t off(1,3) notes: t oe(2) t ce(2)
28c64a ds11109j-page 4 1998 microchip technology inc. table 1-4: byte write ac characteristics figure 1-2: programming waveforms ac testing waveform: v ih = 2.4v; v il = 0.45v; v oh = 2.0v; v ol = 0.8v output load: 1 ttl load + 100 pf input rise/fall times: 20 ns ambient temperature: commercial (c): tamb = 0?c to +70?c industrial (i): tamb = -40?c to +85?c parameter symbol min max units remarks address set-up time t as 10 ns address hold time t ah 50 ns data set-up time t ds 50 ns data hold time t dh 10 ns write pulse width t wpl 100 ns note 1 write pulse high time t wph 50 ns oe hold time t oeh 10 ns oe set-up time t oes 10 ns data valid time t dv 1000 ns note 2 time to device busy t db 250ns write cycle time ( 28c64a )t wc 1 ms 0.5 ms typical write cycle time ( 28c64a f) t wc 200 m s 100 m s typical note 1: a write cycle can be initiated be ce or we going low, whichever occurs last. the data is latched on the pos- itive edge we , whichever occurs ?st. 2: data must be valid within 1000ns max. after a write cycle is initiated and must be stable at least until t dh after the positive edge of we or ce , whichever occurs ?st. t as t ah t wpl t ds t dh t oes t oeh t wc address ce, we data in oe v ih v il v ih v il v ih v il v ih v il rdy/busy v oh v ol t db t dv busy ready
1998 microchip technology inc. ds11109j-page 5 28c64a figure 1-3: data polling waveforms figure 1-4: chip clear waveforms table 1-5: supplementary control mode ce oe we a9 v cc i/o i chip clear v il v ih v il xv cc extra row read v il v il v ih a9 = v h v cc data out extra row write * v ih * a9 = v h v cc data in note: v h = 12.0v 0.5v. *pulsed per programming waveforms. address valid last written address valid t acc t ce t wpl t wph t dv t wc t oe true data out data in valid v ih v il data oe we ce address i/o7 out v ih v il v ih v il v ih v il v ih v il v h v ih ce oe we t s t h t w t s = = 1 s t h = 10ms t w v ih v il v ih v il = 12.0v 0.5v v h
28c64a ds11109j-page 6 1998 microchip technology inc. 2.0 device operation the microchip technology inc. 28c64a has four basic modes of operation?ead, standby, write inhibit, and byte write?s outlined in the following table. 2.1 read mode the 28c64a has two control functions, both of which must be logically satis?d in order to obtain data at the outputs. chip enable (ce ) is the power control and should be used for device selection. output enable (oe ) is the output control and is used to gate data to the output pins independent of device selection. assuming that addresses are stable, address access time (tacc) is equal to the delay from ce to output (tce). data is available at the output t oe after the fall- ing edge of oe , assuming that ce has been low and addresses have been stable for at least t acc -t oe . 2.2 standb y mode the 28c64a is placed in the standby mode by applying a high signal to the ce input. when in the standby mode, the outputs are in a high impedance state, inde- pendent of the oe input. 2.3 data pr otection in order to ensure data integrity, especially during criti- cal power-up and power-down transitions, the following enhanced data protection circuits are incorporated: first, an internal v cc detect (3.3 volts typical) will inhibit the initiation of non-volatile programming operation when v cc is less than the v cc detect circuit trip. second, there is a we ?tering circuit that prevents we pulses of less than 10 ns duration from initiating a write cycle. third, holding we or ce high or oe low, inhibits a write cycle during power-on and power-off (v cc ). operation mode ce oe we i/o rdy/busy (1) read l l h d out h standby h x x high z h write inhibit h x x high z h write inhibit x l x high z h write inhibit x x h high z h byte write l h l d in l byte clear automatic before each ?rite note 1: open drain output. 2: x = any ttl level. 2.4 write mode the 28c64a has a write cycle similar to that of a static ram. the write cycle is completely self-timed and ini- tiated by a low going pulse on the we pin. on the fall- ing edge of we , the address information is latched. on rising edge, the data and the control pins (ce and oe ) are latched. the ready/busy pin goes to a logic low level indicating that the 28c64a is in a write cycle which signals the microprocessor host that the system bus is free for other activity. when ready/busy goes back to a high, the 28c64a has completed writing and is ready to accept another cycle. 2.5 data p olling the 28c64a features data polling to signal the comple- tion of a byte write cycle. during a write cycle, an attempted read of the last byte written results in the data complement of i/o7 (i/o0 to i/o6 are indetermin- able). after completion of the write cycle, true data is available. data polling allows a simple read/compare operation to determine the status of the chip eliminat- ing the need for external hardware. 2.6 electr onic signature f or de vice identi cation an extra row of 32 bytes of eeprom memory is avail- able to the user for device identi?ation. by raising a9 to 12v 0.5v and using address locations 1feo to 1fff, the additional bytes can be written to or read from in the same manner as the regular memory array. 2.7 chip clear all data may be cleared to 1's in a chip clear cycle by raising oe to 12 volts and bringing the we and ce low. this procedure clears all data, except for the extra row.
28c64a 28c64a pr oduct identi cation system to order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory o r the listed sales of?es. package: l = plastic leaded chip carrier (plcc) p = plastic dip (600 mil) so = plastic small outline ic (600 mil) temperature blank = 0 c to +70 c range: i = -40 c to +85 c access time: 15 150 ns 20 200 ns 25 250 ns shipping: blank tube t tape and reel ? and ?o option: blank = twc = 1ms f = twc = 200 m s device: 28c64a 8k x 8 cmos eeprom 28c64a ft?5i/p 1998 microchip technology inc. ds11109j-page 7
information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or oth er intellectual property rights arising from such use or otherwise. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any intellectual property rights. the microchip logo and name are registered trademarks of microchip technology inc. in the u.s.a. and other countries. all rights reserved. al l other trademarks mentioned herein are the property of their respective companies. ? 1999 microchip technology inc. all rights reserved. ? 1999 microchip technology incorporated. printed in the usa. 11/99 printed on recycled paper. americas corporate office microchip technology inc. 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-786-7200 fax: 480-786-7277 technical support: 480-786-7627 web address: http://www.microchip.com atlanta microchip technology inc. 500 sugar mill road, suite 200b atlanta, ga 30350 tel: 770-640-0034 fax: 770-640-0307 boston microchip technology inc. 5 mount royal avenue marlborough, ma 01752 tel: 508-480-9990 fax: 508-480-8575 chicago microchip technology inc. 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas microchip technology inc. 4570 westgrove drive, suite 160 addison, tx 75248 tel: 972-818-7423 fax: 972-818-2924 dayton microchip technology inc. two prestige place, suite 150 miamisburg, oh 45342 tel: 937-291-1654 fax: 937-291-9175 detroit microchip technology inc. tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 los angeles microchip technology inc. 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 new york microchip technology inc. 150 motor parkway, suite 202 hauppauge, ny 11788 tel: 631-273-5305 fax: 631-273-5335 san jose microchip technology inc. 2107 north first street, suite 590 san jose, ca 95131 tel: 408-436-7950 fax: 408-436-7955 americas (continued) toronto microchip technology inc. 5925 airport road, suite 200 mississauga, ontario l4v 1w1, canada tel: 905-405-6279 fax: 905-405-6253 asia/pacific hong kong microchip asia pacific unit 2101, tower 2 metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2-401-1200 fax: 852-2-401-3431 beijing microchip technology, beijing unit 915, 6 chaoyangmen bei dajie dong erhuan road, dongcheng district new china hong kong manhattan building beijing 100027 prc tel: 86-10-85282100 fax: 86-10-85282104 india microchip technology inc. india liaison office no. 6, legacy, convent road bangalore 560 025, india tel: 91-80-229-0061 fax: 91-80-229-0062 japan microchip technology intl. inc. benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa 222-0033 japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea microchip technology korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea tel: 82-2-554-7200 fax: 82-2-558-5934 shanghai microchip technology rm 406 shanghai golden bridge bldg. 2077 yan?an road west, hong qiao district shanghai, prc 200335 tel: 86-21-6275-5700 fax: 86 21-6275-5060 asia/pacific (continued) singapore microchip technology singapore pte ltd. 200 middle road #07-02 prime centre singapore 188980 tel: 65-334-8870 fax: 65-334-8850 taiwan, r.o.c microchip technology taiwan 10f-1c 207 tung hua north road ta i p e i , ta i wa n , ro c tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe united kingdom arizona microchip technology ltd. 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44 118 921 5858 fax: 44-118 921-5835 denmark microchip technology denmark aps regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45 4420 9895 fax: 45 4420 9910 france arizona microchip technology sarl parc d?activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany arizona microchip technology gmbh gustav-heinemann-ring 125 d-81739 mnchen, germany tel: 49-89-627-144 0 fax: 49-89-627-144-44 italy arizona microchip technology srl centro direzionale colleoni palazzo taurus 1 v. le colleoni 1 20041 agrate brianza milan, italy tel: 39-039-65791-1 fax: 39-039-6899883 11/15/99 w orldwide s ales and s ervice microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms and microperipheral products. in addition, microchip ? s quality system for the design and manufacture of development systems is iso 9001 certified.


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